「芯動全球·智啟新程」金晟達(dá)電路在2025世界半導(dǎo)體展邀您共探電路創(chuàng)新邊界！
發(fā)布時間：
2025-07-10 17:20
來源：
2025年，半導(dǎo)體行業(yè)迎來技術(shù)變革新紀(jì)元！金晟達(dá)電路作為高端PCB智造專家，將攜核心技術(shù)與前沿方案，重磅亮相世界半導(dǎo)體展覽會（展位號：T9），與全球伙伴共繪“芯”藍(lán)圖！
In 2025, the semiconductor industry will usher in a new era of technological transformation! As an expert in high-end PCB manufacturing, JSDPCB will showcase its core technologies and cutting-edge solutions at the World Semiconductor Exhibition (Booth No. : T9), and join hands with global partners to draw a blueprint for the "core"!
展會聚焦亮點：
Exhibition highlights:
?? 「硬核技術(shù)」突破：
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高密度互聯(lián)（HDI）電路板，賦能AI服務(wù)器、自動駕駛、衛(wèi)星通信等尖端領(lǐng)域； -
超薄柔性電路板，解鎖可穿戴設(shè)備、折疊屏終端的無限可能； -
高速高頻材料工藝，助力5G/6G、數(shù)據(jù)中心實現(xiàn)“零延遲”傳輸。 -
High-density interconnect (HDI) circuit boards empower cutting-edge fields such as AI servers, autonomous driving, and satellite communications;
Ultra-thin flexible circuit boards unlock unlimited possibilities for wearable devices and foldable screen terminals.
High-speed and high-frequency material technology helps 5G/6G and data centers achieve "zero-latency" transmission.
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?? 「綠色智造」升級：
- 「Green Intelligent Manufacturing」 Upgrade:
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低碳環(huán)保材料+全流程數(shù)字化管控，踐行ESG理念，引領(lǐng)行業(yè)可持續(xù)發(fā)展； -
智能工廠實時演示，見證從設(shè)計到量產(chǎn)的“極速響應(yīng)”。 -
Low-carbon and environmentally friendly materials + full-process digital control, practicing the ESG concept, leading the sustainable development of the industry;
Real-time demonstration of the smart factory, witnessing the "ultra-fast response" from design to mass production.
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?? 「定制化」全鏈服務(wù)：
「Customized」 full-chain service
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1對1專家團(tuán)隊，提供從需求分析、方案設(shè)計到批量交付的“一站式”支持； -
快速打樣服務(wù)，縮短研發(fā)周期，搶占市場先機。 -
A one-on-one expert team provides "one-stop" support from requirement analysis, solution design to batch delivery.
Rapid prototyping service shortens the R&D cycle and seizes market opportunities first.
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?? 「未來對話」論壇：
「Future Dialogue」 Forum：
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技術(shù)大咖現(xiàn)場分享《半導(dǎo)體與PCB協(xié)同創(chuàng)新趨勢》，共探產(chǎn)業(yè)鏈協(xié)同機遇。 -
Technical experts shared on the spot "Trends of Collaborative Innovation in Semiconductors and PCBS", jointly exploring opportunities for industrial chain collaboration.
展會信息：
Exhibition Information：
? 時間：2025年6月20日-22日 Time: June 20th - 22nd, 2025
?? 地點：中國南京國際博覽中心5號館 Location: Hall 5, Nanjing International Expo Center, China
?? 金晟達(dá)展位：T9 JSDPCB booth: T9
服務(wù)熱線(7*24小時)
客戶服務(wù)：service@jsdpcb.cn
業(yè)務(wù)銷售：sales@jsdpcb.cn
市場營銷：marketing@jsdpcb.cn
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